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              KITPRODUCTS

              KIT製品一覧表

              Product

              Ni/Au


              Cu


              Cu
              +OSP
              Core
              E-679FG(R)
              SAC
              Core
              E-700G(R)
              SAC
               Core
              E-700G(R)
              NiPdAu
              +SAC

               Core
              E-705G(R)
              NiPdAu
              +SAC

              Eutectic
              Solder

              Electro
              Sn
              MB50-NCR
              MB50-CR
              CC80
              CC80MarkⅡ 
              FC150LC-1×1    
              FC120-1×1
              FC120-2×2
              FC150-1×1    
              FC150-2×2
              FC150R-2×2
              FC200-1×1    
              FC200-2×2    
              FC200SC-3×3    
              WLP300P/400P
              STAC
                   

              その他のKIT製品



              KIT製品詳細



              WALTS-KIT MB50-0102JY_NCR【MAP】  UPDATE

              ○○○○○○○○イメージ
              Specification WALTS-KIT MB50-0102JY_NCR【MAP】
              *NCR: Non Center Solder Resist
              Solder Resist Under Chip MB50-0102JY_NCR
              Structure 1-2-1 Build up Substrate
              Layer Structure Layer1 Signal Layer (no Via)
              Layer2~Layer4 Mesh
              Outline 187.5mm×64.0mm×t(0.36mm)
              Core Material Core: E-679FGBS
              Build Layer: GX-13
              Solder Resist Material PFR800 AUS-410
              Lead Min L/S 20μm/30μm
              Number of Lead 536
              Pad Dimensions φ0.8μm (SR opening: φ0.65μm)
              Number of Measurement Pad 32 pads
              Electrode Cu+OSP

              WALTS-KIT MB50-0103JY_CR【MAP】
              WALTS-KIT MB50-0104JY_CR【MAP】

              Specification WALTS-KIT MB50-0103JY_CR【MAP】
              WALTS-KIT MB50-0104JY_CR【MAP】
              *CR: Center Solder Resist
              Solder Resist Under Chip MB50-0103JY_CR, MB50-0104JY_CR
              Structure 1-2-1 Build up Substrate
              Layer Structure Layer1 Signal Layer (no Via)
              Layer2~Layer4 Mesh
              Outline 187.5mm×64.0mm×t(0.36mm)
              Core Material Core: E-679FGBS
              Build Layer: ABF-GX92
              Solder Resist Material PSR4000 AUS-703
              Lead Min L/S 20μm/30μm
              Number of Lead 536
              Pad Dimensions φ0.8μm (SR opening: φ0.65μm)
              Number of Measurement Pad 32 pads
              Electrode WALTS-KIT MB50-0103JY_CR【MAP】
               Electroless Ni/Au plating
               Cu + OSP
               Cu (option: Solder Coat / Sn Coat)

              WALTS-KIT MB50-0104JY_CR【MAP】
               Electro Sn plating

               *OSP: Organic Solderability Preservatives

              WALTS-TEG IP40-0101JY *Silicon Interposer

              TEG_IP40
              Specification WALTS-TEG IP40-0101JY
              *Silicon Interposer
              [for WALTS-TEG CC40-0101JY]
              Wafer Size φ 8 inch
              Wafer Thickness 725±25μm
              Chip Size 10.0 mm■
              Pad Pitch (1)
              40μm pitch Full area + Staggered (Model Ⅰ)
              40μm pitch Staggered (Model Ⅱ)
              (2)
              250μm pitch Periphera (Outer Pad)
              Function -- Daisy Chian
              -- Bump Short Check
              ‐‐ Vernier
              -- Breakdown Voltage Check between the Bumps
              Bump Size ---
              Bump Height ---
              Number of Pad Model Ⅰ
              (1) 29576 pads/chip
              (2) 124 pads/chip (Outer Pad)
              Model Ⅱ
              (1) 1352 pads/chip
              (2) 124 pads/chip (Outer Pad)
              Number of Chip 228 chips/wafer
              Polyimide (Option) ---

              WALTS-TEG IP40A-0101JY *Silicon Interposer

              TEG_IP40
              Specification WALTS-TEG IP40A-0101JY
              *Silicon Interposer
              [for WALTS-TEG CC40-0101JY]
              Wafer Size φ 12 inch
              Wafer Thickness 775±25μm
              Chip Size 10.0 mm■
              Pad Pitch (1) 40μm pitch Full area + Staggered
              (2) 250μm pitch Periphera (Outer Pad)
              Function -- Daisy Chian
              -- Bump Short Check
              ‐‐ Vernier
              -- Breakdown Voltage Check between the Bumps
              Bump Size ---
              Bump Height ---
              Number of Pad (1) 29576 pads/chip
              (2) 124 pads/chip (Outer Pad)
              Number of Chip 616 chips/wafer
              Polyimide (Option) ---

              WALTS-TEG IP80-0101JY *Silicon Interposer  >> CONCEPT

              ○○○○○○○○イメージ
              Specification WALTS-TEG IP80-0101JY
              *Silicon Interposer
              [for WALTS-TEG CC80-0101JY]
              Wafer Size φ 8 inch
              Wafer Thickness 725±25μm
              Chip Size 10.0 mm■
              Pad Pitch (1) 80μm Staggered (Inner Pad)
              (2) 300μm Full Area (Center Core)
              (3) 250μm Periphera (Outer Pad)
              Function Daisy Chian
              Bump Size ---
              Bump Height ---
              Number of Pad (1) 648 pads/chip
              (2) 400 pads/chip
              (3) 124 pads/chip
              Number of Chip 228 chips/wafer
              Polyimide (Option)

              WALTS-KIT CC80-0104JY【MAP】(Type A / Type B)  UPDATE

              ○○○○○○○○イメージ
              Specification WALTS-KIT CC80-0104JY【MAP】
              (Type A / Type B)
              Structure 1-2-1 Build up Substrate
              Layer Structure Layer 1, 2 Signal Layer(Via)
              Layer 3, 4 Mesh
              Outline Type A: 187.5mm×64.0mm×t(0.36mm)
              Type B: 187.5mm×64.0mm×t(0.35mm)
              Core Material Core: E-679FGBS
              Build Layer: GX-92
              Solder Resist Material Type A: PSR4000 AUS-703
              Type B: PSR4000 AUS-320
              Lead Min L/S 32μm/48μm
              Number of Lead 648
              Pad Dimensions φ0.75mm (SR opening: φ0.67mm)
              Number of Measurement Pad 72 pads
              Electrode Cu + OSP
              *OSP: Organic Solderability Preservatives

              WALTS-KIT CC80MarkⅡ-0201JY【MAP】  >> CONCEPT

              ○○○○○○○○イメージ
              Specification WALTS-KIT CC80MarkⅡ-0201JY【MAP】
              Structure 1-2-1 Build up Substrate
              Layer Structure Layer 1, 2 Wiringl Layer (Via)
              Layer 3, 4 Dummy Layer (Via)
              Outline 230.0mm×62.5mm×t(0.36mm)
              Core Material Core:HL832NSFLC (0.2mmt)
              Build Layer: ABF-GX13
              Solder Resist Material PFR800 AUS-410
              Lead Min L/S 16μm/24μm
              Number of Electrode 1660 (Peripheral)
              2916 (Center Core)
              Pad Dimensions <Square>
               0.70mm×0.48mm
               (SR opening: 0.62mm×0.40mm)
              <Dome>
               0.71mm×0.48mm
               (SR opening: 0.63mm×0.40mm)
              Number of Measurement Pad <Square> 68 pads
              <Dome> 8 pads
              Electrode Cu
              Cu + OSP
              *OSP: Organic Solderability Preservatives

              WALTS-KIT FC150LC(S)-0303JY  UPDATE

              ○○○○○○○○イメージ
              Specification WALTS-KIT FC150LC-0302JY
              Layer Structure 2-2-2
              Outline 55.0mm×55.0mm×(0.66mmt)
              Core Material Core: E-705G
              Solder Resist PSR4000 AUS-703
              Land Size φ0.13mm●
              Number of Lead 25921 (161×161)
              SR Opening φ85μm●
              Number of Measurement Pad 240 pads
              Daisy Pattern ① Daisy Chain Pattern A: 196 Pads(14×14)
              ② Daisy Chain Pattern B: 72 Pads(12×6)
              ③ Daisy Chain Pattern C: 169 Pads(13×13)
              ④ Daisy Pattern D: 12 Pads(4×3)
              Electrode Cu
              Cu+OSP
              Electroless Plating: Ni/Pd/Au
              Electroless Plating: Ni/Pd/Au+SnAgCu
              Electro Plating: Sn etc.

              WALTS-KIT 01A120P(S)-10 1×1

              /KIT_01A120P(S)-10
              Specification WALTS-01A120P(S)-10 1×1
              Structure Rigid Substrate (Both)
              Outline 30.0mm×30.0mm×t(0.972mmt)
              Core Material Core: MCL-E-705G
              Build Layer:ABF-GX92
              Solder Resist PSR4000 AUS-703
              Land Size φ0.095mm●
              Number of Lead 5776 (76×76)
              SR Opening φ70μm●
              Number of Measurement Pad 24 pads
              Daisy Chain Center Area 18×20 Matrix
              Corner Area 19×20 four Matrix
              Electrode Cu + OSP (option Solder Coat)
              *OSP: Organic Solderability Preservatives

              WALTS-KIT FC120(S) 2×2

              /KIT_FC120(S)
              Specification WALTS-FC120(S) 2×2
              Structure Rigid Substrate (Both)
              Outline 35.0mm×35.0mm×t(0.972mmt)
              Core Material Core: MCL-E-705G
              Build Layer:ABF-GX92
              Solder Resist PSR4000 AUS-703
              Land Size φ0.095mm●
              Number of Lead 23104 (5776/chip×4)
              SR Opening φ70μm●
              Number of Measurement Pad 32 pads
              Daisy Chain Center Area 38×40 Matrix
              Corner Area 19×20 four Matrix
              Electrode Cu + OSP (option Solder Coat)
              *OSP: Organic Solderability Preservatives

              WALTS-KIT 01A150P-10 1×1

              ○○○○○○○○イメージ
              Specification WALTS-KIT 01A150P-10 1×1
              Structure Rigid Substrate (Both)
              Outline 30.0mm×30.0mm×t(0.96mm)
              Core Material Core: E-679FGR
              Solder Resist PSR4000 AUS-703
              Land Size φ0.12mm●
              Number of Lead 3721 (61×61)
              SR Opening φ80μm●
              Number of Measurement Pad 24 pads
              Daisy Chain Center Area 16×15 Matrix
              Corner Area 15×15 four Matrix
              Electrode Electroless Ni/Au Plating
              Cu + OSP (option Solder Coat)
              *OSP: Organic Solderability Preservatives

              WALTS-KIT FC150-0104JY 2×2(E-700G)

              ○○○○○○○○イメージ
              Specification WALTS-KIT FC150-0104JY 2×2
              (E-700G)
              Structure Rigid Substrate (Both)
              Outline 35.0mm×35.0mm×t(0.96mm)
              Core Material Core: E-700G
              Solder Resist PSR4000 AUS-703
              Land Size φ0.12mm●
              Number of Lead 14884 (3721/chip×4)
              SR Opening φ80μm●
              Number of Measurement Pad 32 pads
              Daisy Chain Center Area 30×30 Matrix
              Corner Area 15×15 four Matrix
              Electrode Electroless Ni/Au Plating
              NiPdAu+SAC
              Cu + OSP (option Solder Coat)

              *OSP: Organic Solderability Preservatives

              WALTS-KIT FC150R-0102JY 2×2

              ○○○○○○○○イメージ
              Specification WALTS-KIT FC150R-0102JY 2×2
              Structure Rigid Substrate (Both)
              Outline 35.0mm×35.0mm×t(0.96mm)
              Core Material Core: E-700G
              Solder Resist PSR4000 AUS-703
              Land Size φ0.12mm●
              Number of Lead 14884 (3721/chip×4)
              SR Opening φ80μm●
              Number of Measurement Pad 32 pads
              Daisy Chain Center Area 30×30 Matrix
              Corner Area 15×15 four Matrix
              Electrode Cu
              Cu+OSP
              Electroless Plating:
                Ni/Pd/Au Plating
                NiPdAu+SAC
                Cu + SAC

              *OSP: Organic Solderability Preservatives

              WALTS-KIT 01A200P-10 1×1

              ○○○○○○○○イメージ
              Specification WALTS-KIT 01A200P-10 1×1
              Structure Rigid Substrate (Both)
              Outline 35.0mm×35.0mm×t(0.86mm)
              Core Material core: E-679FGR
              Solder Resist PSR4000 AUS-703
              Land Size φ0.14mm●
              Number of Lead 2116 (46×46)
              Vehicle 10mm×10mm 200μm pitch area
              SR Opening φ95μm●
              Number of Measurement Pad 24 pads
              Daisy Chain Center Area 12×12 Matrix
              Corner Area 12×11 four Matrix
              Electrode Electroless Ni/Au Plating
              Cu
              Cu + OSP (option Solder Coat)
              *OSP: Organic Solderability Preservatives

              WALTS-KIT 01A200P-10_C400 1×1

              ○○○○○○○○イメージ
              Specification WALTS-KIT 01A200P-10_C400 1×1
              Structure Rigid Substrate (Both)
              Outline 35.0mm×35.0mm×t(0.46mm)
              Core Material core: E-679FGR
              Solder Resist PSR4000 AUS-703
              Land Size φ0.14mm●
              Number of Lead 2116 (46×46)
              Vehicle 10mm×10mm 200μm pitch area
              SR Opening φ95μm●
              Number of Measurement Pad 24 pads
              Daisy Chain Center Area 12×12 Matrix
              Corner Area 12×11 four Matrix
              Electrode SnAgCu

              WALTS-KIT FC200-0101JY 2×2
              WALTS-KIT FC200-0102JY 2×2

              ○○○○○○○○イメージ
              Specification WALTS-KIT FC200-0101JY 2×2
              WALTS-KIT FC200-0102JY 2×2
              Structure Rigid Substrate (Both)
              Outline 35.0mm×35.0mm×t(0.87mm)
              Core Material WALTS-KIT FC200-0101JY 2×2
              core: E-679FGR

              WALTS-KIT FC200-0102JY 2×2
              core: E-700GR
              Solder Resist PSR4000 AUS-703
              Land Size φ0.14mm●
              Number of Lead 8464 (2116/chip×4)
              Vehicle 20mm×20mm 200μm pitch area
              SR Opening φ95μm●
              Number of Measurement Pad 32 pads
              Daisy Chain Center Area 20×18 Matrix
              Corner Area 12×11 four Matrix
              Electrode Electroless Ni/Au Plating
              Cu + OSP (option Solder Coat)
              *OSP: Organic Solderability Preservatives

              WALTS-KIT FC200SC-0201JY 3×3  UPDATE

              ○○○○○○○○イメージ
              Specification WALTS-KIT FC200SC-0202JY 3×3
              Structure Rigid Substrate (Both)
              Outline 35.0mm×35.0mm×t(1.05mm)
              Core Material E-700G
              Solder Resist PSR4000 AUS-703
              Land Size φ0.14mm●
              Number of Lead 4356 (484/chip×9)
              Vehicle 15.06mm×15.06mm 200μm pitch area
              SR Opening φ95μm●
              Number of Measurement Pad 64 pads
              Daisy Chain Center Area 12×12 Matrix
              Corner Area 12×11 four Matrix
              Out Side Area 10×7 two Matrix
              Out Side Area 7×12 two Matrix
              Electrode Cu + OSP
              *OSP: Organic Solderability Preservatives

              WALTS-KIT WLP300P/400P

              WLP_300P400P
              Specification WALTS-KIT WLP300P/400P
              * for WLP TEG (0.4mm pitch & 0.3mm pitch)
              Structure 1-0-1 Build up Substrate
              Layer Structure Layer1, Layer2
              Outline 30.0mm×30.0mm×t(0.93mm)
              Core Material Core: E-679FGR
              Build Layer: ABF-GX13
              Solder Resist Material PSR4000 AUS-703
              Number of Lead WLP300P: 264
              WLP400P: 144
              Pad Dimensions 2.4mm×4.0mm
              (SR opening: 2.2mm×3.8mm)
              Number of Measurement Pad 15 pads
              Elctrode Electroless Ni/Au plating 

              WALTS-KIT STAC(S)-0202JY  UPDATE

              ○○○○○○○○イメージ
              Specification WALTS-KIT STAC(S)-0202JY
              Structure Rigid Substrate (Both)
              Outline 45.0mm×45.0mm×t(0.55mm)
              Core Material Core: E-705G
              Solder Resist PSR4000 AUS-703
              FCA Area Pad Pitch: 300μm
              SR Opening: φ110μm
              ?Top Side: for 1×1 chip, 3×3 chip
              ?Bottom Side: for 2×2 chip, 4×4chip
              Electrode Ni/Pd/Au

              WALTS-KIT LCD30-0101JY

              ○○○○○○○○イメージ
              Specification WALTS-KIT LCD30-0101JY
              Material Non Alkali Glass
              Outline 52.55mm×24.00mm×t(0.70mm)
              Wire Material ITO 1,500? (option IZO)
               Function ‐‐Daisy Chain
              ‐‐Breakdown Voltage Check between the Bumps
              Conformed Chip WALTS-TEG LCD30A-0101JY

              WALTS-KIT COF30-0101JY

              ○○○○○○○○イメージ
              Specification WALTS-KIT COF30-0101JY
              State Reel
              Product Name S'PERFLEX
              Plating Material Sn
              Conformed Chip WALTS-TEG LCD30A-0101JY




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